TY - BOOK
AU - Perkins, Andrew E.
AU - Sitaraman, Suresh K.
TI - Solder joint reliability prediction for multiple environments
PB - Springer
SN - 0387793933
SN - 9780387793931
KW - Electronic apparatus and appliances Reliability
KW - Solder and soldering
KW - Joints (Engineering) Reliability
KW - Lötverbindung
KW - Zuverlässigkeit
PY - 2009
CY - New York, NY
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -
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