author = { Lykova, Maria Technische Universität Dresden },

title = { Investigation of Cu-Cu bonding for 2.5D and 3D system integration using self-assembled monolayer as oxidation inhibitor },

edition = { 1. Auflage } ,

publisher = {},

keywords = { Hochschulschrift },

year = {2022},

address = { Dresden },

url = { http://slubdd.de/katalog?TN_libero_mab2 }