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  2. Froemel, Joerg [Author] ; Geßner, Thomas [Degree supervisor]; Geßner, Thomas [Other]; Esashi, Masayoshi [Other]

    Gallium-based Solid Liquid Interdiffusion Bonding of Semiconductor Substrates near room temperature

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    Chemnitz: Universitätsbibliothek Chemnitz; Chemnitz: Universitätsverlag der Technischen Universität Chemnitz, 2015

  14. Wang, Wei-Shan; Wiemer, Maik; Froemel, Joerg; Enderlein, Tom; Gessner, Thomas; Lullin, Justine; Bargiel, Sylwester; Passilly, Nicolas; Albero, Jorge; Gorecki, Christophe

    Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding

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    SPIE, 2016

    Published in: SPIE Proceedings

  15. Wernicke, Tobias; Rebhan, Bernhard; Vuorinen, Vesa; Paulasto-Krockel, Mervi; Dubey, Vikas; Diex, Kevin; Wünsch, Dirk; Baum, Mario; Wiemer, Maik; Tanaka, Shuji; Froemel, Joerg; Aasmundtveit, Knut E.; Nguyen, Hoang V.; Dragoi, Viorel

    Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration

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    The Electrochemical Society, 2023

    Published in: ECS Meeting Abstracts