Media type: Book; Thesis Title: Thermo-mechanische und mikrostrukturelle Charakterisierung von Kupfer-Durchkontaktierungen im Silizium (Through Silicon Vias) Contributor: Sättler, Peter [VerfasserIn] Corporation: Technische Universität Dresden imprint: Dresden, 2015 Extent: XII, 129 Seiten; Illustrationen, Diagramme Language: German RVK notation: ZN 3444 : Kontaktwerkstoffe ZN 4125 : Verbindungstechnik (Löten, Kontaktierung) Keywords: Hochschulschrift Origination: University thesis: Dissertation, Technische Universität Dresden, 2015 Footnote:
Departmental Library DrePunct – open access area Shelf-mark: ZN 3444 S127 Item ID: 34122146 Due date: 2024/05/27 Status: On loan, place hold > Reservation possible ‒ please log in
Central Library – stack Shelf-mark: 2016 8 018539 Item ID: 34122145 Status: Loanable, place order > Ordering possible ‒ please log in
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