You can manage bookmarks using lists, please log in to your user account for this.
Media type:
Book
Title:
Mechanical design of electronic sytems
Contains:
Electronic components and semiconductors services. -- Circuit analysis. -- First level packaging: the chip carrier. -- Second level packaging: substrates and printed circuit boards. -- Production of printed circuit boards. -- Electronics manufacturing: chip carrier to substrate. -- Third level packaging: connectors, cables, modules, card cages and cabinet. -- Thermal analysis methods: conduction. -- Thermal analysis methods: radiation and convection. -- Stress and failure: analysis of mechanical components. -- Thermo-mechanical analysis. -- Analysis of vibration of electronic equipment. -- Theory of reliability. -- Design to improve reliability.
Footnote:
Includes bibliographic references and index
Description:
Electronic components and semiconductors services. -- Circuit analysis. -- First level packaging: the chip carrier. -- Second level packaging: substrates and printed circuit boards. -- Production of printed circuit boards. -- Electronics manufacturing: chip carrier to substrate. -- Third level packaging: connectors, cables, modules, card cages and cabinet. -- Thermal analysis methods: conduction. -- Thermal analysis methods: radiation and convection. -- Stress and failure: analysis of mechanical components. -- Thermo-mechanical analysis. -- Analysis of vibration of electronic equipment. -- Theory of reliability. -- Design to improve reliability