• Media type: E-Article
  • Title: Effects of high temperature aging on the microstructural evolution and mechanical behavior of SAC305 solder joints using synchrotron X-ray microdiffraction and nanoindentation
  • Contributor: Hasnine, Md; Suhling, Jeffrey C.; Bozack, Michael J.
  • imprint: Springer Science and Business Media LLC, 2017
  • Published in: Journal of Materials Science: Materials in Electronics
  • Language: English
  • DOI: 10.1007/s10854-017-7189-7
  • ISSN: 0957-4522; 1573-482X
  • Keywords: Electrical and Electronic Engineering ; Condensed Matter Physics ; Atomic and Molecular Physics, and Optics ; Electronic, Optical and Magnetic Materials
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