Media type: E-Article Title: Nano-Underfills for High-Reliability Applications in Extreme Environments Contributor: Lall, Pradeep; Islam, Saiful; Tian, Guoyun; Suhling, Jeffrey C. imprint: Institute of Electrical and Electronics Engineers (IEEE), 2008 Published in: IEEE Transactions on Components and Packaging Technologies Language: Not determined DOI: 10.1109/tcapt.2008.916807 ISSN: 1521-3331; 1557-9972 Keywords: Electrical and Electronic Engineering ; Electronic, Optical and Magnetic Materials Origination: Footnote: