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  4. Bigalke, Steve [Author] ; Technische Universität Dresden

    Erhöhung der Elektromigrationsrobustheit in der Verdrahtung digitaler Schaltungen - [Als Manuskript gedruckt]

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    Düsseldorf: VDI-Verlag GmbH, [2020] ; Dresden: Technische Universität Dresden, Institut für Feinwerktechnik und Elektronik-Design, [2020]

    Published in: Verein Deutscher Ingenieure: Fortschritt-Berichte VDI / 20 ; 472

  14. Jiang, Tengfei [Author]; Spinella, Laura [Author]; Im, Jay [Author]; Huang, Rui [Author]; Ho, Paul S. [Author]

    Processing Effect on Via Extrusion for Through-Silicon Vias (TSVs) in 3D Interconnects: A Comparative Study of Two TSV Structures : Processing Effect on Via Extrusion for Through-Silicon Vias (TSVs) in 3DInterconnects: A Comparative Study of Two TSV Structures

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    Chemnitz : Technische Universität Chemnitz, [2016]

    Published in: AMC 2015 – Advanced Metallization Conference

  18. Dahl, David [Author] ; Schuster, Christian [Degree supervisor]; Lang, Klaus-Dieter [Degree supervisor]; Ndip, Ivan N. [Degree supervisor]; Bauch, Gerhard [Degree supervisor] Technische Universität Hamburg-Harburg, Technische Universität Hamburg-Harburg Institut für Theoretische Elektrotechnik, Technische Universität Hamburg-Harburg Institut für Theoretische Elektrotechnik

    Electromagnetic modeling and optimization of through silicon vias

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    Hamburg, 2017