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  3. Waechtler, Thomas [Author]; Ding, Shao-Feng [Author]; Hofmann, Lutz [Author]; Mothes, Robert [Author]; Xie, Qi [Author]; Oswald, Steffen [Author]; Detavernier, Christophe [Author]; Schulz, Stefan E. [Author]; Qu, Xin-Ping [Author]; Lang, Heinrich [Author]; Gessner, Thomas [Author] ; Fraunhofer-Institut für Elektronische Nanosysteme ENAS, Technische Universität Chemnitz, Fudan University, Ghent University, Leibniz-Institut für Festkörper- und Werkstoffforschung IFW

    ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems

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    Amsterdam : Elsevier B.V., [2011]

  4. Hu, Xiao [Author] ; Schulz, Stefan E. [Degree supervisor]; Schulz, Stefan E. [Other]; Bartha, Johann W. [Other]; Elliott, Simon D. [Other]

    Multiscale Simulation of Metallic Copper and Copper Oxide Atomic Layer Deposition from Cu Beta-diketonates

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    Chemnitz: Universitätsverlag der Technischen Universität Chemnitz; Chemnitz: Technische Universität Chemnitz, 2018