> Mehrbändiges Werk
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set 1 = Interconnect and wafer bonding technology, vol. 3:
Flexible chip I/O interconnects editors: Muhannad S. Bakir (Georgia Institute of Technology, USA), Suresh K. Sitaraman (Georgia Institute of Technology, USA)
Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020]
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set 1 = Interconnect and wafer bonding technology, vol. 1:
Flip-chip and underfill materials and technology editors: Pengli Zhu (Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, P R China), Gang Li (Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, P R China), C. P. Wong (Georgia Institute of Technology, USA)
Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020]
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set 1 = Interconnect and wafer bonding technology, vol. 2:
Wire bonding technology editors: Dae Young Jung (State University of New York - Binghamton, USA), Stephen R. Cain (State University of New York - Binghamton, USA), William (Bill) T. Chen (Advanced Semiconductor Engineering, Inc. (ASE), Taiwan), Bahgat G. Sammakia (State University of New York - Binghamton, USA)
Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020]
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set 1 = Interconnect and wafer bonding technology, vol. 4:
Wafer bonding technology Kuan-Neng Chen (National Chiao Tung University, Taiwan), Chuan Seng Tan (Nanyang Technological University, Singapore)
Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020]