Skip to contents Suhling, Jeffrey C. [Editor] ; American Society of Mechanical Engineers Applications of experimental mechanics to electronic packaging - 1997 : presented at the 1997 ASME internat. mechanical engineering congress and exposition, Dallas, Tex., Nov. 16 - 21, 1997 Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York, NY: American Society of Mechanical Engineers, 1997 Published in: American Society of Mechanical Engineers: AMD / American Society of Mechanical Engineers, Applied Mechanics Division ; 226 - EEP ; 22 Bar-Cohen, Avram [Editor]; Suhling, Jeffrey C. [Editor]; Tay, Andrew A. O. [Editor] Encyclopedia of packaging materials, processes, and mechanics Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020] Dally, James W. [Author]; Lall, Pradeep [Author]; Suhling, Jeffrey C. [Author] Mechanical design of electronic sytems Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Knoxville, Tennessee: College House Enterprises, LLC, [2008] Meng, Wenjun; Suhling, Jeffrey C. Combined Controller for Test System of High Capacity Hydraulic Pump Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2010 Published in: Journal of Dynamic Systems, Measurement, and Control Ma, Hongtao; Suhling, Jeffrey C. A review of mechanical properties of lead-free solders for electronic packaging Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Springer Science and Business Media LLC, 2009 Published in: Journal of Materials Science Jaeger, Richard C.; Suhling, Jeffrey C. First- and Second-Order Piezoresistive Coefficients of CMOS FETs From Strong Into Weak Inversion Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2019 Published in: IEEE Sensors Journal Jaeger, Richard C.; Chen, Jun; Suhling, Jeffrey C.; Fursin, Leonid First-Order Piezoresistive Coefficients of Lateral NMOS FETs on 4H Silicon Carbide Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2019 Published in: IEEE Sensors Journal Jaeger, Richard C.; Suhling, Jeffrey C.; Chen, Jun Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2018 Published in: Journal of Electronic Packaging Jaeger, Richard C.; Motalab, Mohammad; Hussain, Safina; Suhling, Jeffrey C. Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333] Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2018 Published in: Journal of Electronic Packaging Jaeger, Richard C.; Motalab, Mohammad; Hussain, Safina; Suhling, Jeffrey C. Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2014 Published in: Journal of Electronic Packaging Chen, Yonggang; Jaeger, Richard C.; Suhling, Jeffrey C. CMOS Sensor Arrays for High Resolution Die Stress Mapping in Packaged Integrated Circuits Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2013 Published in: IEEE Sensors Journal Cho, Chun-Hyung; Jaeger, Richard C.; Suhling, Jeffrey C. Characterization of the Temperature Dependence of the Piezoresistive Coefficients of Silicon From ${-}150\,^{\circ}$C to ${+}125\,^{\circ}$C Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2008 Published in: IEEE Sensors Journal Cho, Chun-Hyung; Jaeger, Richard C.; Suhling, Jeffrey C. The Effect of the Transverse Sensitivity on Measurement of the Piezoresistive Coefficients of Silicon Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. IOP Publishing, 2008 Published in: Japanese Journal of Applied Physics Cho, Chun-Hyung; Jaeger, Richard C.; Suhling, Jeffrey C. Evaluation of the Temperature Dependence of the Combined Piezoresistive Coefficients of (111) Silicon Utilizing Chip-on-Beam and Hydrostatic Calibration Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Korean Physical Society, 2008 Published in: Journal of the Korean Physical Society Lall, Pradeep; Mehta, Vishal; Suhling, Jeffrey C.; Blecker, Ken Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing At Extreme Surrounding Temperatures for 6 Months of Isothermal Aging Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2024 Published in: Journal of Electronic Packaging Ahmed, Md. Tusher; Motalab, Mohammad; Suhling, Jeffrey C. Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Springer Science and Business Media LLC, 2021 Published in: Journal of Electronic Materials Hasnine, Md; Suhling, Jeffrey C.; Bozack, Michael J. Effects of high temperature aging on the microstructural evolution and mechanical behavior of SAC305 solder joints using synchrotron X-ray microdiffraction and nanoindentation Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Springer Science and Business Media LLC, 2017 Published in: Journal of Materials Science: Materials in Electronics Lall, Pradeep; Choudhary, Prakriti; Gupte, Sameep; Suhling, Jeffrey C. Health Monitoring for Damage Initiation and Progression During Mechanical Shock in Electronic Assemblies Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2008 Published in: IEEE Transactions on Components and Packaging Technologies Lall, Pradeep; Islam, Saiful; Tian, Guoyun; Suhling, Jeffrey C. Nano-Underfills for High-Reliability Applications in Extreme Environments Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2008 Published in: IEEE Transactions on Components and Packaging Technologies Gnanachchelvi, Parameshwaran; Wilamowski, Bogdan M.; Jaeger, Richard C.; Hussain, Safina; Suhling, Jeffrey C.; Hamilton, Michael C. A 1D numerical model for rapid stress analysis in bipolar junction transistors Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Wiley, 2016 Published in: International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
Suhling, Jeffrey C. [Editor] ; American Society of Mechanical Engineers Applications of experimental mechanics to electronic packaging - 1997 : presented at the 1997 ASME internat. mechanical engineering congress and exposition, Dallas, Tex., Nov. 16 - 21, 1997 Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York, NY: American Society of Mechanical Engineers, 1997 Published in: American Society of Mechanical Engineers: AMD / American Society of Mechanical Engineers, Applied Mechanics Division ; 226 - EEP ; 22
Bar-Cohen, Avram [Editor]; Suhling, Jeffrey C. [Editor]; Tay, Andrew A. O. [Editor] Encyclopedia of packaging materials, processes, and mechanics Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020]
Dally, James W. [Author]; Lall, Pradeep [Author]; Suhling, Jeffrey C. [Author] Mechanical design of electronic sytems Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Knoxville, Tennessee: College House Enterprises, LLC, [2008]
Meng, Wenjun; Suhling, Jeffrey C. Combined Controller for Test System of High Capacity Hydraulic Pump Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2010 Published in: Journal of Dynamic Systems, Measurement, and Control
Ma, Hongtao; Suhling, Jeffrey C. A review of mechanical properties of lead-free solders for electronic packaging Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Springer Science and Business Media LLC, 2009 Published in: Journal of Materials Science
Jaeger, Richard C.; Suhling, Jeffrey C. First- and Second-Order Piezoresistive Coefficients of CMOS FETs From Strong Into Weak Inversion Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2019 Published in: IEEE Sensors Journal
Jaeger, Richard C.; Chen, Jun; Suhling, Jeffrey C.; Fursin, Leonid First-Order Piezoresistive Coefficients of Lateral NMOS FETs on 4H Silicon Carbide Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2019 Published in: IEEE Sensors Journal
Jaeger, Richard C.; Suhling, Jeffrey C.; Chen, Jun Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2018 Published in: Journal of Electronic Packaging
Jaeger, Richard C.; Motalab, Mohammad; Hussain, Safina; Suhling, Jeffrey C. Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333] Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2018 Published in: Journal of Electronic Packaging
Jaeger, Richard C.; Motalab, Mohammad; Hussain, Safina; Suhling, Jeffrey C. Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2014 Published in: Journal of Electronic Packaging
Chen, Yonggang; Jaeger, Richard C.; Suhling, Jeffrey C. CMOS Sensor Arrays for High Resolution Die Stress Mapping in Packaged Integrated Circuits Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2013 Published in: IEEE Sensors Journal
Cho, Chun-Hyung; Jaeger, Richard C.; Suhling, Jeffrey C. Characterization of the Temperature Dependence of the Piezoresistive Coefficients of Silicon From ${-}150\,^{\circ}$C to ${+}125\,^{\circ}$C Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2008 Published in: IEEE Sensors Journal
Cho, Chun-Hyung; Jaeger, Richard C.; Suhling, Jeffrey C. The Effect of the Transverse Sensitivity on Measurement of the Piezoresistive Coefficients of Silicon Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. IOP Publishing, 2008 Published in: Japanese Journal of Applied Physics
Cho, Chun-Hyung; Jaeger, Richard C.; Suhling, Jeffrey C. Evaluation of the Temperature Dependence of the Combined Piezoresistive Coefficients of (111) Silicon Utilizing Chip-on-Beam and Hydrostatic Calibration Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Korean Physical Society, 2008 Published in: Journal of the Korean Physical Society
Lall, Pradeep; Mehta, Vishal; Suhling, Jeffrey C.; Blecker, Ken Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing At Extreme Surrounding Temperatures for 6 Months of Isothermal Aging Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. ASME International, 2024 Published in: Journal of Electronic Packaging
Ahmed, Md. Tusher; Motalab, Mohammad; Suhling, Jeffrey C. Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Springer Science and Business Media LLC, 2021 Published in: Journal of Electronic Materials
Hasnine, Md; Suhling, Jeffrey C.; Bozack, Michael J. Effects of high temperature aging on the microstructural evolution and mechanical behavior of SAC305 solder joints using synchrotron X-ray microdiffraction and nanoindentation Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Springer Science and Business Media LLC, 2017 Published in: Journal of Materials Science: Materials in Electronics
Lall, Pradeep; Choudhary, Prakriti; Gupte, Sameep; Suhling, Jeffrey C. Health Monitoring for Damage Initiation and Progression During Mechanical Shock in Electronic Assemblies Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2008 Published in: IEEE Transactions on Components and Packaging Technologies
Lall, Pradeep; Islam, Saiful; Tian, Guoyun; Suhling, Jeffrey C. Nano-Underfills for High-Reliability Applications in Extreme Environments Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Institute of Electrical and Electronics Engineers (IEEE), 2008 Published in: IEEE Transactions on Components and Packaging Technologies
Gnanachchelvi, Parameshwaran; Wilamowski, Bogdan M.; Jaeger, Richard C.; Hussain, Safina; Suhling, Jeffrey C.; Hamilton, Michael C. A 1D numerical model for rapid stress analysis in bipolar junction transistors Articles View online Schließen > Access Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Wiley, 2016 Published in: International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
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